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PBSS9110X
100 V, 1 A PNP low VCEsat (BISS) transistor
Rev. 02 -- 22 November 2009 Product data sheet
1. Product profile
1.1 General description
PNP low VCEsat Breakthrough In Small Signal (BISS) transistor in a SOT89 (SC-62/ TO-243) SMD plastic package. NPN complement: PBSS8110X.
1.2 Features
SOT89 package Low collector-emitter saturation voltage VCEsat High collector current capability IC and ICM High efficiency leading to less heat generation
1.3 Applications
Major application segments: Automotive 42 V power Telecom infrastructure Industrial Peripheral driver: Driver in low supply voltage applications (e.g. lamps and LEDs) Inductive load driver (e.g. relays, buzzers and motors) DC-to-DC conversion
1.4 Quick reference data
Table 1. Symbol VCEO IC ICM RCEsat
[1]
Quick reference data Parameter collector-emitter voltage collector current (DC) peak collector current collector-emitter saturation resistance single pulse; tp 1 ms IC = -1 A; IB = -100 mA
[1]
Conditions open base
Min -
Typ 170
Max -100 -1 -3 320
Unit V A A m
Pulse test: tp 300 s; 0.02.
NXP Semiconductors
PBSS9110X
100 V, 1 A PNP low VCEsat (BISS) transistor
2. Pinning information
Table 2. Pin 1 2 3 Pinning Description emitter collector base
3 2 1 3 1
006aaa231
Simplified outline
Symbol
2
3. Ordering information
Table 3. Ordering information Package Name PBSS9110X SC-62 Description plastic surface mounted package; collector pad for good heat transfer; 3 leads Version SOT89 Type number
4. Marking
Table 4. Marking codes Marking code[1] *4C Type number PBSS9110X
[1] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China
PBSS9110X_2
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 22 November 2009
2 of 15
NXP Semiconductors
PBSS9110X
100 V, 1 A PNP low VCEsat (BISS) transistor
5. Limiting values
Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCBO VCEO VEBO IC ICM IB Ptot Parameter collector-base voltage collector-emitter voltage emitter-base voltage collector current (DC) peak collector current base current (DC) total power dissipation Tamb 25 C
[1] [2] [3]
Conditions open emitter open base open collector single pulse; tp 1 ms
Min -65 -65
Max -120 -100 -5 -1 -3 -0.3 0.55 1.4 2.0 150 +150 +150
Unit V V V A A A W W W C C C
Tj Tamb Tstg
[1] [2] [3]
junction temperature ambient temperature storage temperature
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, standard footprint. Device mounted on an FR4 PCB, single-sided copper, tin-plated, 6cm2 collector mounting pad. Device mounted on a ceramic PCB, Al2O3, standard footprint.
2.0 Ptot (W) 1.6
006aaa408 (1)
(2)
1.2
0.8
(3)
0.4
0 0 40 80 120 160 Tamb (C)
(1) Ceramic PCB, Al2O3, standard footprint (2) FR4 PCB, mounting pad for collector 6cm2 (3) FR4 PCB, standard footprint
Fig 1.
Power derating curves
PBSS9110X_2
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 22 November 2009
3 of 15
NXP Semiconductors
PBSS9110X
100 V, 1 A PNP low VCEsat (BISS) transistor
6. Thermal characteristics
Table 6. Symbol Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to ambient Conditions in free air
[1] [2] [3]
Min -
Typ -
Max 227 89 63 16
Unit K/W K/W K/W K/W
Rth(j-sp)
[1] [2] [3]
thermal resistance from junction to solder point
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6cm2. Device mounted on a ceramic PCB, AL2O3, standard footprint.
103 Zth(j-a) (K/W) duty cycle = 1 0.75 2 10 0.5 0.33 0.2 0.1 0.05 0.02 0.01 1 0
006aaa409
10
10-1 10-5
10-4
10-3
10-2
10-1
1
10
102 t p (s)
103
FR4 PCB, standard footprint
Fig 2.
Transient thermal impedance from junction to ambient as a function of pulse time; typical values
PBSS9110X_2
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 22 November 2009
4 of 15
NXP Semiconductors
PBSS9110X
100 V, 1 A PNP low VCEsat (BISS) transistor
103 Zth(j-a) (K/W) 102 duty cycle = 1 0.75 0.5 0.33 0.2 0.1 0.05 0.02 1 0.01 0
006aaa411
10
10-1 10-5
10-4
10-3
10-2
10-1
1
10
102 t p (s)
103
FR4 PCB, mounting pad for collector 6cm2
Fig 3.
102 Zth(j-a) (K/W)
Transient thermal impedance from junction to ambient as a function of pulse time; typical values
006aaa410
duty cycle = 1 0.75 0.5 0.33 0.2 0.1 0.05 0.02
10
1
0.01 0
10-1 10-5
10-4
10-3
10-2
10-1
1
10
102 t p (s)
103
Ceramic PCB, Al2O3, standard footprint
Fig 4.
Transient thermal impedance from junction to ambient as a function of pulse time; typical values
PBSS9110X_2
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 22 November 2009
5 of 15
NXP Semiconductors
PBSS9110X
100 V, 1 A PNP low VCEsat (BISS) transistor
7. Characteristics
Table 7. Characteristics Tamb = 25 C unless otherwise specified. Symbol Parameter ICBO collector-base cut-off current Conditions VCB = -80 V; IE = 0 A VCB = -80 V; IE = 0 A; Tj = 150 C Min 150 150
[1] [1]
Typ 170 20 60 80 290 120 410 -
Max -100 -50 -100 -100 450 -120 -180 -320 320 -1.1 -1.0 17
Unit nA A nA nA
ICES IEBO hFE
collector-emitter cut-off VCE = -80 V; VBE = 0 V current emitter-base cut-off current DC current gain VEB = -4 V; IC = 0 A VCE = -5 V; IC = -1 mA VCE = -5 V; IC = -250 mA VCE = -5 V; IC = -0.5 A VCE = -5 V; IC = -1 A
150 125 -
VCEsat
collector-emitter saturation voltage
IC = -250 mA; IB = -25 mA IC = -500 mA; IB = -50 mA IC = -1 A; IB = -100 mA
[1] [1]
mV mV mV m V V ns ns ns ns ns ns MHz pF
-
RCEsat VBEsat VBEon td tr ton ts tf toff fT Cc
[1]
collector-emitter saturation resistance
IC = -1 A; IB = -100 mA
base-emitter saturation IC = -1 A; IB = -100 mA voltage base-emitter turn-on voltage delay time rise time turn-on time storage time fall time turn-off time transition frequency collector capacitance IC = -50 mA; VCE = -10 V; f = 100 MHz IE = ie = 0 A; VCB = -10 V; f = 1 MHz IC = -1 A; VCE = -5 V VCC = -10 V; IC = -0.5 A; IBon = -0.025 A; IBoff = 0.025 A
100 -
Pulse test: tp 300 s; 0.02.
PBSS9110X_2
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 22 November 2009
6 of 15
NXP Semiconductors
PBSS9110X
100 V, 1 A PNP low VCEsat (BISS) transistor
600 hFE
(1)
001aaa376
-1.2 VBE (V) -0.8
(1)
001aaa377
400
(2)
(2)
(3)
200
(3)
-0.4
0 -10-1
-1
-10
-102
-103 -104 IC (mA)
0 -10-1
-1
-10
-102
-103 -104 IC (mA)
VCE = -10 V (1) Tamb = 100 C (2) Tamb = 25 C (3) Tamb = -55 C
VCE = -10 V (1) Tamb = -55 C (2) Tamb = 25 C (3) Tamb = 100 C
Fig 5.
DC current gain as a function of collector current; typical values
-1
001aaa378
Fig 6.
Base-emitter voltage as a function of collector current; typical values
-1
001aaa380
VCEsat (V)
VCEsat (V)
-10-1
-10-1
(1) (2) (1) (2) (3)
-10-2 -10-1
-1
-10
-102
-103 -104 IC (mA)
-10-2 -10-1
-1
-10
-102
-103 -104 IC (mA)
IC/IB = 10 (1) Tamb = 100 C (2) Tamb = 25 C (3) Tamb = -55 C
Tamb = 25 C (1) IC/IB = 50 (2) IC/IB = 20
Fig 7.
Collector-emitter saturation voltage as a function of collector current; typical values
Fig 8.
Collector-emitter saturation voltage as a function of collector current; typical values
PBSS9110X_2
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 22 November 2009
7 of 15
NXP Semiconductors
PBSS9110X
100 V, 1 A PNP low VCEsat (BISS) transistor
-10
001aaa381
-10
001aaa379
VBEsat (V)
VBEsat (V)
-1
(1) (2) (3)
-1
-10-1 -10-1
-1
-10
-102
-103 -104 IC (mA)
-10-1 -10-1
-1
-10
-102
-103 -104 IC (mA)
IC/IB = 10 (1) Tamb = -55 C (2) Tamb = 25 C (3) Tamb = 100 C
IC/IB = 20 Tamb = 25 C
Fig 9.
Base-emitter saturation voltage as a function of collector current; typical values
001aaa382
Fig 10. Base-emitter saturation voltage as a function of collector current; typical values
103 RCEsat () 102
001aaa383
103 RCEsat () 102
10
(1) (2)
10
(1)
1
(3)
1
(2)
10-1 -10-1
-1
-10
-102
-103 -104 IC (mA)
10-1 -10-1
-1
-10
-102
-103 -104 IC (mA)
IC/IB = 10 (1) Tamb = -55 C (2) Tamb = 25 C (3) Tamb = 100 C
Tamb = 25 C (1) IC/IB = 50 (2) IC/IB = 20
Fig 11. Collector-emitter saturation resistance as a function of collector current; typical values
Fig 12. Collector-emitter saturation resistance as a function of collector current; typical values
PBSS9110X_2
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 22 November 2009
8 of 15
NXP Semiconductors
PBSS9110X
100 V, 1 A PNP low VCEsat (BISS) transistor
IB (mA) = -45 IC -40.5 (A) -36 -1.6 -31.5 -27 -1.2
-2
001aaa384
-0.8
-0.4
-22.5 -18 -13.5 -9 -4.5
0 0
-1
-2
-3
-4
VCE (V)
-5
Fig 13. Collector current as a function of collector-emitter voltage; typical values
PBSS9110X_2
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 22 November 2009
9 of 15
NXP Semiconductors
PBSS9110X
100 V, 1 A PNP low VCEsat (BISS) transistor
8. Test information
-I B
90 % input pulse (idealized waveform)
-I Bon (100 %)
10 %
-I Boff
-I C
90 %
output pulse (idealized waveform)
-I C (100 %)
10 % t td t on tr ts t off tf
006aaa266
Fig 14. BISS transistor switching time definition
VBB VCC
RB (probe) oscilloscope 450 VI R1 R2
RC Vo (probe) 450 DUT oscilloscope
mgd624
VCC = -10 V; IC = -0.5 A; IBon = -0.025 A; IBoff = 0.025 A
Fig 15. Test circuit for switching times
PBSS9110X_2
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 22 November 2009
10 of 15
NXP Semiconductors
PBSS9110X
100 V, 1 A PNP low VCEsat (BISS) transistor
9. Package outline
4.6 4.4 1.8 1.4
1.6 1.4
2.6 2.4
4.25 3.75 1.2 0.8 0.48 0.35 3 0.44 0.23 06-08-29
1 0.53 0.40 1.5 Dimensions in mm
2
3
Fig 16. Package outline SOT89 (SC-62/TO-243)
10. Packing information
Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number PBSS9110X
[1]
Package SOT89
Description 8 mm pitch, 12 mm tape and reel
Packing quantity 1000 -115 4000 -135
For further information and the availability of packing methods, see Section 15.
PBSS9110X_2
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 22 November 2009
11 of 15
NXP Semiconductors
PBSS9110X
100 V, 1 A PNP low VCEsat (BISS) transistor
11. Soldering
4.75 2.25 2.00 1.90 1.20 solder lands 0.85 0.20 solder resist occupied area 1.20 4.60 0.50 1.20 1.20 1.70 solder paste 4.85
Dimensions in mm
1.00 (3x)
3
2
1
msa442
0.60 (3x) 0.70 (3x) 3.70 3.95
SOT89 standard mounting conditions for reflow soldering Dimensions in mm
Fig 17. Reflow soldering footprint SOT89 (SC-62/TO-243)
12. Mounting
32 mm 32 mm 30 mm
40 mm
2.5 mm 1 mm 3 mm 2.5 mm 1 mm 0.5 mm 5 mm 3.96 mm 1.6 mm
001aaa234
40 mm 2.5 mm 1 mm 0.5 mm
20 mm
5 mm 3.96 mm 1.6 mm
001aaa235
Fig 18. FR4 PCB, standard footprint
Fig 19. FR4 PCB, mounting pad for collector 6cm2
(c) NXP B.V. 2009. All rights reserved.
PBSS9110X_2
Product data sheet
Rev. 02 -- 22 November 2009
12 of 15
NXP Semiconductors
PBSS9110X
100 V, 1 A PNP low VCEsat (BISS) transistor
13. Revision history
Table 9. Revision history Release date 20091122 Data sheet status Product data sheet Change notice Supersedes PBSS9110X_1 Document ID PBSS9110X_2 Modifications:
* * *
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. Figure 12 "Collector-emitter saturation resistance as a function of collector current; typical values": updated Figure 13 "Collector current as a function of collector-emitter voltage; typical values": updated Product data sheet -
PBSS9110X_1
20050502
PBSS9110X_2
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 22 November 2009
13 of 15
NXP Semiconductors
PBSS9110X
100 V, 1 A PNP low VCEsat (BISS) transistor
14. Legal information
14.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
14.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
14.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental
14.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
15. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
PBSS9110X_2
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 22 November 2009
14 of 15
NXP Semiconductors
PBSS9110X
100 V, 1 A PNP low VCEsat (BISS) transistor
16. Contents
1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 13 14 14.1 14.2 14.3 14.4 15 16 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics . . . . . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Test information . . . . . . . . . . . . . . . . . . . . . . . . 10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 Packing information . . . . . . . . . . . . . . . . . . . . 11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 14 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Contact information. . . . . . . . . . . . . . . . . . . . . 14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 22 November 2009 Document identifier: PBSS9110X_2

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